PCAP Touchscreens with a Common Connector

ABSTRACT

Some embodiments include fabricating a narrow border of a projected capacitive (PCAP) touchscreen. Some embodiments include a vertical electrode on a cover glass coupled to a first set of traces within the narrow border, and printing a first insulating black mask (BM) layer on the cover glass, that includes a first opening above an electrode terminus of the vertical electrode. Some embodiments further include printing a portion of a conductive black via (BV) in the first opening, coupling the conductive BV to the electrode terminus and a first silver trace of the first set of silver traces. Some embodiments include combining the cover glass with a sensor glass, where the first set of silver traces substantially overlaps a second set of silver traces of the sensor glass within the narrow border, where the overlapped sets of silver traces are separated by a shield layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. Nonprovisional application Ser.No. 16/653,060, filed on Oct. 15, 2019, entitled, PCAP Touchscreens witha Narrow Border Design, which is incorporated herein by reference in itsentirety.

BACKGROUND Field

The present disclosure relates generally to projected capacitive (PCAP)touch sensitive systems, and more specifically to the border design ofPCAP touchscreens.

Background Art

The ability to interact with computer applications via touch withdisplays is ubiquitous for today's consumers. While several touchtechnologies are possible to support touch interactions, each hasadvantages and disadvantages that tailor each for particularenvironments, sizes, and applications. Projected capacitive (PCAP)technology is utilized to support characteristics expected from touchinteractions in touch/display interface devices.

An approach to laying out transmitter and receiver silver traces on aborder of a PCAP touchscreen is to avoid overlapping of the transmitterand receiver silver traces.

SUMMARY

System, method, combination, sub-combination and other embodiments areprovided for glass/glass (2GS) or glass/film/film (GFF) projectedcapacitive (PCAP) touchscreens and their construction. In a 2GS PCAPtouchscreen, indium-tin-oxide (ITO) or equivalent on a glass ispatterned by printing silver ink, and by ablating both the ITO andsilver with a laser. Similarly, in a GFF PCAP touchscreen, the films arecoated with ITO or equivalent, patterned by printing silver ink, andboth the ITO and silver are ablated with a laser. In some embodiments,any transparent conductive film, such as silver-nanowire coating, thatcan be laser ablated is considered to be an equivalent to ITO.Accordingly, in the descriptions that follow, it is to be understoodthat “ITO” is shorthand for “ITO or equivalent”.

Some embodiments include fabricating a narrow border of a PCAPtouchscreen. The method may include for example, disposing on a coverglass, a first transparent electrode coupled to a first set of silvertraces within the narrow border of the PCAP touchscreen. The methodincludes printing a first insulating black mask (BM) layer on the coverglass, where the first insulating BM layer includes a first openingabove an electrode terminus of the first transparent electrode of theone or more vertical electrodes, and printing a portion of a conductiveblack via (BV) in the first opening, where the portion of the conductiveBV may be coupled to the electrode terminus of the vertical electrodeand coupled to a first silver trace of the first set of silver traces.Some embodiments include disposing on a sensor glass, a secondtransparent electrode parallel to the first transparent electrode, wherethe second transparent electrode may be coupled to a second set ofsilver traces. Some embodiments include combining the cover glass withthe sensor glass, where the first set of silver traces substantiallyoverlaps the second set of silver traces within the narrow border of thePCAP touchscreen, and where the overlapped sets of silver traces areseparated by a shield layer.

Some embodiments for the cover glass include printing silver paste onthe portion of the conductive BV and on the first insulating BM layerwhere transmitter and receiver silver traces are desired, and using alaser to ablate excess silver paste. Using the laser to ablate excesssilver paste may include: leaving a deposit of the silver paste within aboundary of the portion of the conductive BV where the deposit iscoupled to the first silver trace, and/or defining remaining silvertraces of the first set of silver traces. In some embodiments, the laserablation of the excess silver paste creates one or more second openingsthrough the silver paste and the first insulating BM layer to the firstlayer, and some embodiments include printing a second insulating BMlayer that fills the one or more second openings. In some embodiments,printing the second insulating BM layer includes printing the secondinsulating BM layer that covers the first set of silver traces except athird opening that exposes leads of the first set of silver traces thatmay be coupled with a connector (e.g., a flex cable connector.)

Some embodiments for the sensor glass include printing silver paste onthe sensor glass where transmitter and receiver silver traces aredesired, and using a laser to ablate excess silver paste. Someembodiments further include printing an insulation layer tosubstantially overlap the second set of silver traces, such that whenthe sensor glass assembly is combined with cover glass assembly, theinsulation layer and the second set of silver traces are located thewithin the narrow border of the PCAP touchscreen. In some embodiments,the shield layer is printed on the insulation layer. In someembodiments, the printing of the silver paste on the second layer mayinclude printing a ground silver trace, and the insulation layer may beprinted around a third opening that exposes the ground silver trace tothe shield layer.

In some embodiments, assembling or combining of the cover glass and thesensor glass includes applying an adhesive between the cover glassassembly and the sensor glass assembly. The adhesive may be a solidoptically clear adhesive (OCA) including but is not limited to anacrylic-based adhesive, a silicone-based adhesive, polyvinyl butyral(PVB), or ethylene-vinyl acetate (EVA).

Further embodiments, features, and advantages of the present disclosure,as well as the structure and operation of the various embodiments of thepresent disclosure, are described in detail below with reference to theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS/FIGURES

The accompanying drawings, which are incorporated herein and form partof the specification, illustrate the present disclosure and, togetherwith the description, further serve to explain the principles of thedisclosure and to enable a person skilled in the relevant art(s) to makeand use the disclosure.

FIG. 1A illustrates a projected capacitive (PCAP) touchscreen with anarrow border, according to an exemplary embodiment of the disclosure;

FIG. 1B illustrates a PCAP touchscreen on a display device;

FIG. 1C illustrates a portion of a PCAP touchscreen with a narrowborder, according to an exemplary embodiment of the disclosure;

FIG. 1D illustrates a portion of a PCAP touchscreen;

FIG. 2A illustrates a cross-section of a glass/glass (2GS) PCAPtouchscreen, according to an exemplary embodiment of the disclosure;

FIG. 2B illustrates a cross-section of a glass/film/film (GFF) PCAPtouchscreen, according to an exemplary embodiment of the disclosure;

FIG. 3A illustrates an example of a cover glass with a transparentelectrode layer, according to an exemplary embodiment of the disclosure;

FIG. 3B illustrates an example of a cover glass with a verticalelectrode, according to an exemplary embodiment of the disclosure;

FIG. 4A illustrates an example of an insulating black mask (BM) printedon the cover glass and around an electrode terminus of a verticalelectrode, according to an exemplary embodiment of the disclosure;

FIG. 4B illustrates an example of a conductive black via (BV) printed onan electrode terminus of a vertical electrode, according to an exemplaryembodiment of the disclosure;

FIG. 5A illustrates an example of a silver paste printed on a portion ofa conductive BV and on the insulating BM printed on the cover glass,according to an exemplary embodiment of the disclosure;

FIG. 5B illustrates an example of an ablation of excess silver paste,according to an exemplary embodiment of the disclosure;

FIG. 6 illustrates an example of another insulating BM printed to fillgaps through to the cover glass, according to an exemplary embodiment ofthe disclosure;

FIG. 7A illustrates an example of a sensor glass with a transparentelectrode layer, according to an exemplary embodiment of the disclosure;

FIG. 7B illustrates an example of a sensor glass with a horizontalelectrode, according to an exemplary embodiment of the disclosure;

FIG. 8A illustrates an example of silver paste printed on a portion ofthe sensor glass, according to an exemplary embodiment of thedisclosure;

FIG. 8B illustrates an example of an ablation of excess silver paste,according to an exemplary embodiment of the disclosure;

FIG. 9A illustrates an example of an insulation layer printed to coversilver traces on the sensor glass, according to an exemplary embodimentof the disclosure;

FIG. 9B illustrates an example of a shield layer printed on theinsulation layer, according to an exemplary embodiment of thedisclosure;

FIG. 9C illustrates an example sensor glass assembly with a shield layerprinted on the insulation layer, according to an exemplary embodiment ofthe disclosure;

FIG. 10 illustrates an example of a combination of the cover glassassembly and the sensor glass assembly, according to an exemplaryembodiment of the disclosure;

FIG. 11 illustrates an example of a method for fabricating a cover glassassembly, according to an exemplary embodiment of the disclosure;

FIG. 12 illustrates an example of a method for fabricating a sensorglass assembly, according to an exemplary embodiment of the disclosure;

FIG. 13 illustrates an example of a method for combining a cover glassassembly and a sensor glass assembly, according to an exemplaryembodiment of the disclosure; and

FIG. 14 illustrates an example computer system useful for implementingand/or using various embodiments.

The present disclosure will now be described with reference to theaccompanying drawings. In the drawings, generally, like referencenumbers indicate identical or functionally similar elements.Additionally, generally, the left-most digit(s) of a reference numberidentifies the drawing in which the reference number first appears.

DETAILED DESCRIPTION

The following Detailed Description of the present disclosure refers tothe accompanying drawings that illustrate exemplary embodimentsconsistent with this disclosure. The exemplary embodiments will fullyreveal the general nature of the disclosure that others can, by applyingknowledge of those skilled in relevant art(s), readily modify and/oradapt for various applications such exemplary embodiments, without undueexperimentation, without departing from the spirit and scope of thedisclosure. Therefore, such adaptations and modifications are intendedto be within the meaning and plurality of equivalents of the exemplaryembodiments based upon the teaching and guidance presented herein. It isto be understood that the phraseology or terminology herein is for thepurpose of description and not of limitation, such that the terminologyor phraseology of the present specification is to be interpreted bythose skilled in relevant art(s) in light of the teachings herein.Therefore, the detailed description is not meant to limit the presentdisclosure.

The embodiment(s) described, and references in the specification to “oneembodiment”, “an embodiment”, “an example embodiment”, etc., indicatethat the embodiment(s) described may include a particular feature,structure, or characteristic, but every embodiment may not necessarilyinclude the particular feature, structure, or characteristic. Moreover,such phrases are not necessarily referring to the same embodiment.Further, when a particular feature, structure, or characteristic isdescribed in connection with an embodiment, it is understood that it iswithin the knowledge of one skilled in the art to effect such feature,structure, or characteristic in connection with other embodimentswhether or not explicitly described.

Some embodiments include fabricating a narrow border of a PCAPtouchscreen. FIG. 1A illustrates a projected capacitive (PCAP)touchscreen 105 with narrow border 130, according to an exemplaryembodiment of the disclosure. PCAP touchscreen 105 may be placed infront of display device 110 such as a monitor, computing device, acomputer, a laptop, a tablet, and/or a mobile computing device, to namejust some examples. PCAP touchscreen 105 also includes a connector (notshown) that electronically couples PCAP touchscreen 105 to displaydevice 110. A user can interact with software applications on displaydevice 110 by touching cover sheet touch surface 137 of touchscreen 105.A portion 150 of touchscreen 105 is described further in FIG. 1C.Cross-section 120 of PCAP touchscreen 105 is described further in FIGS.2A and 2B.

FIG. 1B illustrates a PCAP touchscreen 107 on display device 110 with acover glass touch surface 137. Portion 180 of touchscreen 107 includeswide border 140. A portion 180 of touchscreen 107 is described furtherin FIG. 1D.

FIG. 1C illustrates portion 150 of PCAP touchscreen 105 with narrowborder 130, according to an exemplary embodiment of the disclosure.Portion 150 includes view area 152 where the content on display device110 is visible to a user. First set of silver traces 154 substantiallyoverlaps with second set of silver traces 156 and the substantialoverlap occurs within narrow border 130. In addition, first set ofsilver traces 154 is separated from overlapping second set of silvertraces 156 by shield layer 160. Shield layer 160 may include aninsulation layer. Shield layer 160 and the insulation layer may besimilar to shield layer 960 and insulation layer 910 described below.FIG. 1D illustrates a portion 180 of PCAP touchscreen 107. Portion 180includes view area 182 where the content on display device 110 isvisible to a user. View area 182 is smaller than view area 152. Firstset of silver traces 184 do no overlap with second set of silver traces186 that are within wide border 140. The overlap of first set of silvertraces 154 and second set of silver traces 156 that are separated by atleast shield layer 160 enables narrow border 130 to be narrower thanwide border 140. Consequently, height 158 of narrow border 130 is lessthan height 188 of wide border 140. The same is true of the width ofnarrow border 130 being less than the width of wide border 140 (notshown.)

FIG. 2A illustrates cross-section 120A of glass/glass (2GS) PCAPtouchscreen 105, according to an exemplary embodiment of the disclosure.For explanation purposes, FIG. 2A may be described with elements fromprevious figures. Cross-section 120A may include cover glass 275,transparent conductor 280, adhesive 283, transparent conductor 285, andsensor glass 290. A user interacts with touchscreen 105 by touchingcover glass touch surface 137. Information from the touch on cover glasstouch surface 137 are collected via transparent conductors 280 and 285,and conveyed to display device 110 electronically. Other implementationsinclude but are not limited to a three glass (3GS) solution in which thecover glass contains no electrodes and there are two back glasses eachwith electrodes.

FIG. 2B illustrates cross-section 120B of glass/film/film (GFF) PCAPtouchscreen 105, according to an exemplary embodiment of the disclosure.For explanation purposes, FIG. 2B may be described with elements fromprevious figures. Cross-section 120B may include cover glass 235,adhesive 243, transparent conductor 245, film 250, adhesive 253,transparent conductor 255, and film 260. A user interacts withtouchscreen 105 by touching cover glass touch surface 237. Informationfrom the touch on cover glass touch surface 237 is collected viatransparent conductors 245 and 255, and conveyed to display device 110electronically.

Adhesive layers 243, 253, and 283 may be a solid optically clearadhesive (OCA) that can be an acrylic-based adhesive, a silicone-basedadhesive, polyvinyl butyral (PVB), ethylene-vinyl acetate (EVA), or anyother suitable OCA that will be recognized by those skilled in therelevant art(s). Transparent conductors 245, 255, 280, and 285 arecircuitry layers that may include electrodes, routing traces, and traceshields of materials such as indium-tin-oxide (ITO), carbon nanotubes,graphene, silver-nanowires, silver, and/or metal mesh. (The transparentconductors 245, 255, 280, and 285 are typically microscopically thin,but for clarity they are not drawn to scale in FIGS. 2A and 2B.Furthermore, there is no air gap between adhesives and glasses (e.g.,adhesive 283 and cover glass 275, adhesive 283 and sensor glass 290,adhesive 243 and cover glass 235) or adhesives and a film (e.g.,adhesive 253 and film 260); adhesive 243 conforms to the inside surfaceof cover glass 235 and transparent conductor 245 and adhesive 253 tofilm 250 and transparent conductor 255 which in turn conforms to film260 with no air gap.

FIG. 3A illustrates an example 300 of a cover glass 275 with transparentconductor 280, according to an exemplary embodiment of the disclosure.For explanation purposes, FIG. 3A may be described with elements fromprevious figures. Example 300 a is a planar view of portion 150 of PCAPtouchscreen 105, example 300 b is a cross-section view of planar view300 a taken at 302, example 300 c is a cross-section view of planar view300 a taken at 304, and example 300 d is a magnified view ofcross-section view 300 c. To fabricate narrow border 130 of PCAPtouchscreen 105, some embodiments include disposing on a first layer, afirst transparent electrode. In planar view 300 a, transparent conductor280 may be disposed on cover glass 275. Cross-section view 300 b takenat 302 illustrates cross-section transparent conductor 280′ disposed oncross-section cover glass 275′. Cross-section view 300 c taken at 304illustrates cross-section transparent conductor 280″ on cross-sectioncover glass 275″, and cross-section view 300 d illustrates a magnifiedview of cross-section view 300 c.

FIG. 3B illustrates an example 350 of a cover glass 275 with verticalelectrodes 360, according to an exemplary embodiment of the disclosure.For explanation purposes, FIG. 3B may be described with elements fromprevious figures. Example 350 a is a planar view of portion 150 of PCAPtouchscreen 105, example 350 b is a cross-section view of planar view350 a taken at 352, example 350 c is a cross-section view of planar view350 a taken at 354, and example 350 d is a magnified view ofcross-section view 350 c. In some embodiments, a first transparentelectrode comprises a vertical electrode. For example, portions oftransparent conductor 280 may be removed to generate parallel electrodessuch as vertical or horizontal electrodes. In planar view 350 a,vertical electrodes 360 are created. While 6 and one half verticalelectrodes 360 are shown, only 2 are labeled to simplify the drawings.Each end of a vertical electrode 360 is called an electrode terminus.Cross-section view 350 b taken at 352 illustrates cross-section verticalelectrodes 360′ disposed on cross-section cover glass 275′.Cross-section view 350 c taken at 354 illustrates cross-sectiontransparent conductor 360″ on cross-section cover glass 275″, andcross-section view 350 d illustrates a magnified view of cross-sectionview 350 c.

FIG. 4A illustrates example 400 of insulating black mask (BM) layer 410printed on cover glass 275 and an opening 420, around each electrodeterminus of a vertical electrode 360, according to an exemplaryembodiment of the disclosure. For explanation purposes, FIG. 4A may bedescribed with elements from previous figures. Example 400 a is a planarview of portion 150 of PCAP touchscreen 105, example 400 b is across-section view of planar view 400 a taken at 402, example 400 c is across-section view of planar view 400 a taken at 404, and example 400 dis a magnified view of cross-section view 400 c. To fabricate narrowborder 130 of PCAP touchscreen 105, some embodiments include printing afirst insulating BM layer on the first layer, wherein the firstinsulating BM layer includes a first opening above an electrode terminusof the vertical electrode. In planar view 400 a, first insulating BMlayer 410 may be printed on cover glass 275 that marks narrow border 130on touchscreen 105. First insulating BM layer 410 may cover a part ofvertical electrodes 360 but include an opening 420 over each electrodeterminus. In this example, 6 and one half openings 420 are shown, butonly 2 are labeled to simplify the drawings. Cross-section view 400 btaken at 402 illustrates cross-section vertical electrodes 360′ disposedon cross-section cover glass 275′. In addition, cross-section firstinsulating BM layer 410′ is shown at the ends of and betweencross-section vertical electrodes 360′. Cross-section view 400 c takenat 404 illustrates cross-section transparent conductor 360″ oncross-section cover glass 275″ with the addition of cross-section firstinsulation BM layer 410″. Note that cross-section opening 420″ is anarea where cross section cover glass 275″ is exposed. Cross-section view400 d illustrates a magnified view of cross-section view 400 c.

FIG. 4B illustrates an example 450 of conductive black via (BV) 460printed on an electrode terminus of a vertical electrode 360, accordingto an exemplary embodiment of the disclosure. For explanation purposes,FIG. 4B may be described with elements from previous figures. Example450 a is a planar view of portion 150 of PCAP touchscreen 105, example450 b is a cross-section view of planar view 450 a taken at 452, example450 c is a cross-section view of planar view 450 a taken at 454, andexample 450 d is a magnified view of cross-section view 450 c. Tofabricate narrow border 130 of PCAP touchscreen 105, some embodimentsinclude printing a portion of a conductive BV in the first opening,wherein the portion of the conductive BV is coupled to the electrodeterminus. In planar view 450 a, a portion of conductive BV 460 may beprinted in each opening 420, and the portion of conductive BV 460 may becoupled to an electrode terminus of a vertical electrode 360 and firstinsulation BM layer 410.

Cross-section view 450 b taken at 452 illustrates cross-section verticalelectrodes 360′ disposed on cross-section cover glass 275′. Openings 420are filled and cross-sections conductive BV 460′ are shown on top ofcross-section vertical electrodes 360′; cross-section first insulatingBM layer 410′ is shown at the ends of and between cross-section verticalelectrodes 360′ and cross-sections of conductive BV 460′. Cross-sectionview 450 c taken at 454 illustrates cross-section transparent conductor360″ on cross-section cover glass 275″ with the addition ofcross-section first insulation BM layer 410″. Note that cross-sectionopening 420″ has been filled with cross-section of conductive BV 460″.Cross-section view 400 d illustrates a magnified view of cross-sectionview 400 c.

FIG. 5A illustrates example 500 of silver paste 510 printed on portionsof conductive BV 460 and on first insulating BM layer 410 printed oncover glass 275, according to an exemplary embodiment of the disclosure.For explanation purposes, FIG. 5A may be described with elements fromprevious figures. Example 500 a is a planar view of portion 150 of PCAPtouchscreen 105, example 500 b is a cross-section view of planar view500 a taken at 502, example 500 c is a cross-section view of planar view500 a taken at 504, and example 500 d is a magnified view ofcross-section view 500 c. To fabricate narrow border 130 of PCAPtouchscreen 105, some embodiments include printing silver paste on theportion of the conductive BV and on the first insulating BM layer wheretransmitter or receiver silver traces are desired. For example, silverpaste 510 may be printed on portions of conductive BV 460 as well as onareas of first insulating BM layer 410 where transmitter, receiver,and/or ground silver traces are desired. Although the oval label forsilver paste 510 includes a narrow portion of silver paste 510, notethat silver paste 510 also includes the unconventional pattern belowincluding portions on conductive BV 460.

Cross-section view 500 b taken at 502 illustrates cross-section verticalelectrodes 360′ disposed on cross-section cover glass 275′. Crosssections of silver paste 510′ are illustrated as printed oncross-sections of portions of conductive BVs 460′ that are shown oncross-section vertical electrodes 360′. Cross-section first insulatingBM layer 410′ is shown at the ends of and between cross-section verticalelectrodes 360′ and cross-sections of conductive BV 460′, and below somecross-sections of silver paste 510′. Cross-section view 500 c taken at504 illustrates cross-section transparent conductor 360″ oncross-section cover glass 275″, cross-section first insulation BM layer410″, and cross-section of conductive BV 460″. Cross-section silverpaste 510″ is added on top of cross-section conductive BV 460″ andcross-section first insulation BM layer 410″. Cross-section view 500 dillustrates a magnified view of cross-section view 500 c.

FIG. 5B illustrates example 550 of an ablation of silver paste 510excess, according to an exemplary embodiment of the disclosure. Forexplanation purposes, FIG. 5B may be described with elements fromprevious figures. Example 550 a is a planar view of portion 150 of PCAPtouchscreen 105, example 550 b is a cross-section view of planar view550 a taken at 552, example 550 c is a cross-section view of planar view550 a taken at 554, and example 550 d is a magnified view ofcross-section view 550 c. To fabricate narrow border 130 of PCAPtouchscreen 105, some embodiments include using a laser (not shown) toablate excess silver paste that includes leaving a deposit of the silverpaste within a boundary of the portion of the conductive BV where thedeposit is coupled to the first silver trace, and defining remainingsilver traces of the first set of silver traces. For example, a lasermay be used to remove excess silver paste 510 on first insulating BMlayer 410 to define first set of silver traces 560. First set of silvertraces 560 may be equivalent to first set of silver traces 154 of FIG.1C. In addition, a laser may be used to remove excess silver paste 510to leave a silver paste deposit 570 on portions of conductive BV 460.Silver paste deposits 570 are coupled to first set of silver traces 560.Although 6 and one half silver paste deposits 570 are shown, only threeare labeled to simplify the drawing.

Cross-section view 550 b taken at 552 illustrates cross-section verticalelectrodes 360′ disposed on cross-section cover glass 275′. In someembodiments, laser ablations may remove excess of silver paste 510′ asshown in cross-section view 500 b of FIG. 5A, to form cross-sections ofsilver paste deposits 570′ in cross-section view 550 b of FIG. 5B.Cross-sections of silver paste deposits 570′ are illustrated oncross-sections of portions of conductive BVs 460′ on cross-sectionvertical electrodes 360′. Cross-section first insulating BM layer 410′is shown at the ends of and between cross-section vertical electrodes360′ and cross-sections of conductive BV 460′.

Cross-section views 550 c and 550 d taken at 554 illustrate thefollowing on cross-section cover glass 275″: cross-section transparentconductor 360″; cross-section first insulation BM layer 410″; andcross-section conductive BV 460″. Laser ablations of cross-sectionsilver paste 510″ create a) cross-sections of first set of silver traces560″ on cross-section first insulation BM layer 410″; and b)cross-sections of silver paste deposits 570″ on top of cross-sectionconductive BV 460″ and cross section first insulation BM layer 410″.

Cross-section view 550 d further illustrates that the laser ablation mayremove not only the excess silver paste to create cross-sections ofsilver paste deposits 570″, but the laser ablation may also remove partsof first insulating BM layer down to the cover glass 275″. Thus,patterns left due to the laser ablation could be visible within narrowborder 130 of FIG. 1A. For example, the laser ablations may removeexcess cross-section silver paste 510″ down to cover glass 275″ increating cross-section first set of silver traces 560″, and the exposedportions of cover glass 275″ are labeled as gaps 565″. Although two gaps565″ are shown and labeled to simplify the drawing, there may be othergaps 565″ present that are not represented in the drawing.

FIG. 6 illustrates example 600 of another insulating BM layer 610printed to fill gaps 565″ through to cover glass 275″, according to anexemplary embodiment of the disclosure. For explanation purposes, FIG. 6may be described with elements from previous figures. Example 600 a is aplanar view of portion 150 of PCAP touchscreen 105, example 600 b is across-section view of planar view 600 a taken at 602, example 600 c is across-section view of planar view 600 a taken at 604, and example 600 dis a magnified view of cross-section view 600 c. To fabricate narrowborder 130 of PCAP touchscreen 105, some embodiments include creating agap through the silver paste and the first insulating BM layer to thefirst layer, and printing a second insulating BM layer that fills thegap. Further, printing the second insulating BM layer may includeprinting the second insulating BM layer that covers the first set ofsilver traces except a second opening that exposes leads of the firstset of silver traces to be coupled with a connector. For example, asecond insulating BM layer 610 may be printed to: a) cover first set ofsilver traces 560 (e.g., first set of silver traces 560″); b) cover aportion of first insulating BM layer 410 (e.g., shown as 410″) except atopening 620 where a connector may be coupled to leads of silver paste510 (e.g., a connector to a flex cable that couples touchscreen 105 todisplay device 110 as shown on FIG. 1A); and c) fill gaps 565″ that werecreated by the laser ablation as shown in cross-section views 600 c and600 d.

Cross-section view 600 b taken at 602 illustrates cross-section verticalelectrodes 360′ disposed on cross-section cover glass 275′.Cross-section first insulating BM layer 410′ is shown at the ends of andbetween cross-section vertical electrodes 360′ and cross-sections ofconductive BV 460′. Cross-sections of silver paste deposits 570′ areillustrated on cross-sections of portions of conductive BVs 460′ thatare shown on cross-section vertical electrodes 360′.

Cross-section view 600 d illustrates that cross-section secondinsulating BM layer 610″ covers cross-sections of first insulating BMlayer 410″, cross-sections of silver paste deposits 570″, cross-sectionsof first set of silver traces 560″, and fills in gaps 565″.

FIG. 7A illustrates example 700 of sensor glass 290 with transparentconductor 285, according to an exemplary embodiment of the disclosure.For explanation purposes, FIG. 7A may be described with elements fromprevious figures. Example 700 a is a planar view of portion 150 of PCAPtouchscreen 105, example 700 b is a cross-section view of planar view700 a taken at 702, example 700 c is a cross-section view of planar view700 a taken at 704. To fabricate narrow border 130 of PCAP touchscreen105, some embodiments include disposing on a second layer, a secondtransparent electrode parallel to the first transparent electrode. Forexample, transparent conductor 285 may be disposed on sensor glass 290.Cross-section view 700 b taken at 702 illustrates cross-sectiontransparent conductor 285′ disposed on cross-section sensor glass 290′.Cross-section view 700 c taken at 704 illustrates cross-sectiontransparent conductor 285″ on cross-section sensor glass 290″.

FIG. 7B illustrates example 750 of sensor glass 290 with horizontalelectrode 760, according to an exemplary embodiment of the disclosure.For explanation purposes, FIG. 7B may be described with elements fromprevious figures. In some embodiments, a second transparent electrodecomprises a horizontal electrode. For example, portions of transparentconductor 285 may be removed to generate parallel electrodes such asvertical or horizontal electrodes. In this example, horizontalelectrodes 760 are created. While 4 horizontal electrodes 760 are shown,only 2 are labeled to simplify the drawings. Each end of a horizontalelectrode 760 is called an electrode terminus. Example 750 a is a planarview of portion 150 of PCAP touchscreen 105, example 750 b is across-section view of planar view 750 a taken at 752, example 750 c is across-section view of planar view 750 a taken at 754. Cross-section view750 b taken at 752 illustrates cross-section horizontal electrodes 760′disposed on cross-section sensor glass 290′. Cross-section view 750 ctaken at 754 illustrates cross-section horizontal electrodes 760″disposed on cross-section sensor glass 290″.

FIG. 8A illustrates example 800 of silver paste 810 printed on a portionof sensor glass 290, according to an exemplary embodiment of thedisclosure. For explanation purposes, FIG. 8A may be described withelements from previous figures. Example 800 a is a planar view ofportion 150 of PCAP touchscreen 105, example 800 b is a cross-sectionview of planar view 800 a taken at 802, example 800 c is a cross-sectionview of planar view 800 a taken at 804. To fabricate narrow border 130of PCAP touchscreen 105, some embodiments include printing silver pasteon the second layer where transmitter or receiver silver traces aredesired, where the silver paste is coupled to a second transparentelectrode. For example, silver paste 810 may be printed on portions ofsensor glass 290 where transmitter, receiver, and/or ground silvertraces are desired, and silver paste 810 may be coupled to horizontalelectrodes 760. Although the oval label of silver paste 810 encirclesonly a part of silver paste 810, note that silver paste 810 alsoincludes the areas with the same pattern. Cross-section view 800 b takenat 802 illustrates cross-section horizontal electrodes 760′ disposed oncross-section sensor glass 290′. Cross sections of silver paste 810′ areillustrated as printed on cross-sections of portions of cross-sectionhorizontal electrodes 760′ and sensor glass 290′. Cross-section view 800c taken at 804 illustrates cross-section horizontal electrodes 760″disposed on cross-section sensor glass 290″. Cross sections of silverpaste 810″ are illustrated as printed on sensor glass 290″.

FIG. 8B illustrates example 850 of excess silver paste 810 ablation,according to an exemplary embodiment of the disclosure. For explanationpurposes, FIG. 8B may be described with elements from previous figures.Example 850 a is a planar view of portion 150 of PCAP touchscreen 105,example 850 b is a cross-section view of planar view 850 a taken at 852,and cross-section view 850 c is a magnification of cross-section view850 b. Example 850 d is a cross-section view of planar view 850 a takenat 854, and cross-section view 850 e is a magnified view ofcross-section view 850 d. To fabricate narrow border 130 of PCAPtouchscreen 105, some embodiments include using a laser (not shown) toablate excess silver paste. For example, a laser may be used to removesome parts of silver paste 810 on sensor glass 290 to define a secondset of silver traces 860 (e.g., the laser ablation may remove parts ofsilver paste 810 that are not needed so that second set of silver traces860 remains.) In an example, second set of silver traces 860 may beequivalent to second set of silver traces 156 of FIG. 1C. Cross-sectionview 850 b taken at 852 illustrates cross-section horizontal electrodes760′ disposed on cross-section sensor glass 290′. Cross-sections ofsilver paste 810′ are illustrated on cross-sections of portions ofcross-section horizontal electrodes 760′ and sensor glass 290′.Cross-section view 800 c is a magnified view of cross-section view 850 bwhere the spaces between cross-sections of silver paste 810′ arevisible.

Cross-section view 850 d taken at 854 illustrate cross-sectionhorizontal electrodes 760″ disposed on cross-section sensor glass 290″and cross-sections of silver paste 810″ are illustrated as printed oncross-section sensor glass 290″. Cross-section view 850 e illustrates amagnification of cross-sections of silver paste 810″ on cross-sectionsensor glass 290″ including spaces where cross-sections of silver paste810″ are not printed on cross-section sensor glass 290″.

FIG. 9A illustrates example 900 of insulation layer 910 printed to coversecond set of silver traces 860 on the sensor glass, according to anexemplary embodiment of the disclosure. For explanation purposes, FIG.9A may be described with elements from previous figures. Example 900 ais a planar view of portion 150 of PCAP touchscreen 105, example 900 bis a cross-section view of planar view 900 a taken at 902, andcross-section view 900 c is a magnification of cross-section view 900 b.Example 900 d is a cross-section view of planar view 900 a taken at 904,and cross-section view 900 e is a magnified view of cross-section view900 d. Example 900 f is a cross-section view of planar view 900 a takenat 906 across insulation layer 910 and opening 915.

To fabricate narrow border 130 of PCAP touchscreen 105, some embodimentsinclude printing an insulation layer to substantially overlap the secondset of silver traces within the narrow border of the PCAP touchscreen.In some embodiments, printing the silver paste on the second layerincludes printing a ground silver trace, and printing the insulationlayer includes printing the insulation around a second opening thatexposes the ground silver trace. For example, insulation layer 910 maybe printed to substantially cover second set of silver traces 860.Portions of second set of silver traces 860 may remain uncovered such assilver trace leads 920 and silver paste 810. Further, insulation layer910 may include an opening 915 through which a ground silver trace 930is left exposed (e.g., not covered by insulation layer 910.)

Cross-section view 900 b taken at 902 illustrates cross-sectionhorizontal electrodes 760′ disposed on cross-section sensor glass 290′.Cross-sections of silver paste 810′ are illustrated on cross-sections ofportions of cross-section horizontal electrodes 760′ and sensor glass290′. Cross-section view 900 c is a magnification of portions of 900 band illustrates spaces between cross-sections of silver paste 810′. Notethat cross-sections of silver paste 810′ includes cross-section groundsilver trace 930′.

Cross-section view 900 d taken at 904 illustrates cross-sectioninsulation layer 910″ filling spaces between cross-sections of silverpaste 810″ on cross-section sensor glass 290″ such that the spaces arenot visible in narrow border 130 of FIG. 1A, for example. Cross-sectionview 900 e is a magnification of cross-sections of silver paste 810″that includes cross-section ground silver trace 930″, which is coveredby cross-section insulation layer 910″.

Cross-section view 900 f taken at 906 illustrates cross-section opening915″ shown as spaces on cross-section sensor glass 290″ adjacent tocross-section ground silver trace 930″, where cross-section groundsilver trace 930″ is not covered by cross-section insulation layer 910″.In contrast, remaining cross-sections of silver paste 810″ are coveredby cross-section insulation layer 910″.

FIG. 9B illustrates example 950 of shield layer 960 printed oninsulation layer 910, according to an exemplary embodiment of thedisclosure. For explanation purposes, FIG. 9B may be described withelements from previous figures. Example 950 a is a planar view ofportion 150 of PCAP touchscreen 105, example 950 b is a cross-sectionview of planar view 950 a taken at 952, and cross-section view 950 c isa magnification of cross-section view 950 b. Example 950 d is across-section view of planar view 950 a taken at 954, and cross-sectionview 950 e is a magnified view of cross-section view 950 d. Example 950f is a cross-section view of planar view 950 a taken at 956 acrossinsulation layer 910 and opening 915.

To fabricate narrow border 130 of PCAP touchscreen 105, some embodimentsinclude printing a shield layer on the insulation layer, where thesecond opening in the insulation layer leaves the ground silver traceexposed to the shield layer. For example, shield layer 960 may beprinted to substantially cover insulation layer 910. Further, shieldlayer 960 may be coupled with ground silver trace 930 due to opening 915in insulation layer 910. Shield layer 960 may be equivalent to shieldlayer 160 of FIG. 1C, for example.

Cross-section view 950 b taken at 952 illustrates cross-sectionhorizontal electrodes 760′ disposed on cross-section sensor glass 290′.Cross-sections of silver paste 810′ are illustrated on cross-sections ofportions of cross-section horizontal electrodes 760′ and sensor glass290′. Cross-section view 950 c is a magnification of portions of 950 band illustrates spaces between cross-sections of silver paste 810′. Notethat cross-sections of silver paste 810′ includes cross-section groundsilver trace 930′.

Cross-section view 950 d taken at 954 illustrates cross-section shieldlayer 960″ added to cross-section insulation layer 910″ that fillsspaces between cross-sections of silver paste 810″ on cross-sectionsensor glass 290″ such that the spaces are not visible in narrow border130 of FIG. 1A. Cross-section view 950 e is a magnification ofcross-sections of silver paste 810″ that includes cross-section groundsilver trace 930″, which are covered by cross-section insulation layer910″. Cross-section shield layer 960″ is located on top of cross-sectioninsulation layer 910″.

Cross-section view 950 f taken at 956 illustrates cross-section opening915″ shown as spaces on cross-section sensor glass 290″ adjacent tocross-section ground silver trace 930″, where cross-section shield layer960″ fills in the space left by cross-section opening 915″ as shown in900 f of FIG. 9A, around cross-section ground silver trace 930″. Thus,cross-section shield layer 960″ may be coupled to portions ofcross-sections of silver paste 810″ such as ground silver trace 930″. Incontrast, remaining cross-sections of silver paste 810″ are coupled tocross-section insulation layer 910″. Some portions of cross-sectioninsulation layer 910″ that cover remaining cross-sections of silverpaste 810″ are coupled to cross-section shield layer 960″.

FIG. 9C illustrates an example sensor glass assembly 990 with a shieldlayer 960 y printed on insulation layer 910 y, according to an exemplaryembodiment of the disclosure. Sensor glass assembly 990 is composed likesensor glass assembly 950, where the orientation of parts like silverpaste 810 are located on a different side (e.g., inverted along they-axis.) Since the composition is the same but with a differentorientation, labels of example 990 are identified with the addition of a“y”. Thus, planar view 990 a includes but is not limited to: sensorglass 290 y, with horizontal electrodes 760 y, silver paste 810 y, andinsulation layer 910 y coupled to shield layer 960 y, where silver traceleads 920 y may remain uncovered. Planar view 990 a can be a portion 150of PCAP touchscreen 105, and example 990 b is a cross-section view ofplanar view 990 a taken at 952 y.

Cross-section view 990 b taken at 952 y illustrates cross-sectionhorizontal electrodes 760 y′ disposed on cross-section sensor glass 290y′. Cross-sections of silver paste 810 y′ are illustrated oncross-sections of portions of cross-section horizontal electrodes 760 y′and sensor glass 290 y′. Note that cross-sections of silver paste 810 y′includes cross-section ground silver trace 930 y′.

FIG. 10 illustrates example 1000 of combination of the cover glassassembly 600 of FIG. 6 and the sensor glass assembly 990 of FIG. 9C,according to an exemplary embodiment of the disclosure. For explanationpurposes, FIG. 10 may be described with elements from previous figures.In some embodiments, combination 1000 is equivalent to 150 of FIG. 1C,where shield layer 160 is equivalent to shield layer 960 y of FIG. 9C,that is not visible in combination 1000.

To fabricate narrow border 130 of PCAP touchscreen 105, some embodimentsinclude assembling the first layer with the second layer, where thefirst set of silver traces substantially overlaps the second set ofsilver traces within the narrow border of the PCAP touchscreen, andwhere the overlapped sets of silver traces are separated by a shieldlayer. Some embodiments further include applying an adhesive between thefirst layer and the second layer. For example, cover glass assembly 600may be assembled with sensor glass assembly 990 with adhesive 283 (ofFIG. 2A) between them. In other words, adhesive 283 may be sandwichedbetween cover glass assembly 600 on the bottom and sensor glass assembly990 on the top as shown in combination 1000. Vertical electrodes 360 arealigned with horizontal electrodes 760 y and first set of silver traces560 (not shown) of cover glass assembly 600 substantially overlap secondset of silver traces 860 y coupled to second insulating BM layer 610,where the overlapped first set of silver traces 560 and second set ofsilver traces 860 y are separated by shield layer 960 y and insulationlayer 910 y. Cross-section view 1000 b taken at 1002 illustrates acombination of cross-section view 600 b taken at 602 and cross-sectionview 990 b taken at 952 y with the addition of adhesive 283.Accordingly, those descriptions are not repeated here.

FIG. 11 illustrates an example of a method 1100 for fabricating a coverglass assembly (e.g., cover glass assembly 600) for a narrow border 130of PCAP touchscreen 105, according to an exemplary embodiment of thedisclosure. For explanation purposes, FIG. 11 may be described withelements from previous figures.

At 1110, method 1100 includes disposing a first transparent electrode ona first layer. For example, method 1100 may include disposingtransparent conductor 280 onto cover glass 275.

At 1120, method 1100 includes removing portions of the first transparentelectrode to form parallel directional electrode pads (e.g., verticalelectrode pads). For example, method 1100 may include removing portionsof transparent conductor 280 to produce one or more vertical electrodes360 on cover glass 275.

At 1130, method 1130 includes printing a first insulating black mask(BM) layer to form a narrow border on the perimeter of the first layer,where the first insulating BM layer includes an opening above anelectrode terminus of the directional electrode pad (e.g., a rectangularopening within the first insulating BM layer that leaves the end of theelectrode terminus exposed). For example, method 1130 may print firstinsulating BM layer 410 on the perimeter of cover glass 275, where firstinsulating BM layer 410 includes opening 420 above an electrode terminusof vertical electrode 360.

At 1140, method 1100 includes printing a portion of conductive black via(BV) in the opening on the electrode terminus of a directional electrodepad. The portion of the conductive BV may overlap the first insulatingBM layer without touching an adjacent portion of conductive BV. Forexample, method 1100 includes printing a portion of conductive BV 460 inopening 420 so that the portion of conductive BV 460 is coupled with anelectrode terminus of vertical electrode 360. The portion of conductiveBV 460 may exceed opening 420 without touching another portion ofconductive BV 460.

At 1150, method 1100 includes printing silver paste on the portion ofthe conductive BV as well as on the first insulating BM layer wheretransmitter, receiver, and/or ground silver traces are desired. Forexample, method 1100 includes printing silver paste 510 on portions ofconductive BV 460 as well as on first insulating BM layer 410 wheretransmitter, receiver, and/or ground silver traces are desired.

At 1160, method 1100 includes using a laser to ablate excess silverpaste to: a) define silver traces, and b) optionally leave a deposit ofthe silver paste within a boundary of a portion of the conductive BVwhere the deposit is coupled to a silver trace. For example, method 1100includes using a laser to remove parts of silver paste 510 that are notneeded. The laser ablation may remove excess silver paste 510 to definefirst set of silver traces 560 that may include transmitter, receiver,and/or ground silver traces. In addition, in some embodiments the laserablation may leave a silver paste deposit 570 on one or more portions ofconductive BV 460, where each silver paste deposit 570 is coupled to asilver trace of first set of silver traces 560.

At 1170, method 1100 includes printing a second insulating BM layer onthe first insulating BM layer along the border where a connector isdesired, where the second insulating BM layer includes an opening largeenough to leave a portion of the silver traces exposed (e.g., leads ofthe silver traces to be coupled to a connector. In addition, the secondinsulating BM layer may leave parts of the silver paste deposit exposed.For example, method 1100 may include printing second insulating BM layer610 along narrow border 130 where a connector is desired (e.g., aconnector to a flex cable that couples touchscreen 105 to display device110.) Second insulating BM layer 610 includes opening 620 that leaves aportion of silver paste 510 or first set of silver traces 560 exposed.

At 1180, method 1100 includes printing the second insulating BM layerthat fills openings made by the laser ablation such that the secondinsulating BM layer is adjacent to the cover glass. For example, method1100 may include printing second insulating BM layer 610 to fill gaps565′ or equivalent.

FIG. 12 illustrates an example of a method 1200 for the fabrication of asensor glass assembly 950 for a narrow border 130 of PCAP touchscreen105, according to an exemplary embodiment of the disclosure. Forexplanation purposes, FIG. 12 may be described with elements fromprevious figures.

At 1210, method 1200 includes disposing a second transparent electrodeon a second layer. For example, method 1200 may include disposingtransparent conductor 285 on sensor glass 290.

At 1220, method 1200 includes removing portions of the secondtransparent electrode to form parallel directional electrode pads (e.g.,horizontal electrode pads). For example, method 1200 may includeremoving portions of transparent conductor 285 to form second electrodesor horizontal electrodes 760 on sensor glass 290.

At 1230, method 1200 includes printing silver paste on the second layerin areas where transmitter, receiver, and/or ground silver traces aredesired. For example, method 1200 may include printing silver paste 810on areas of sensor glass 290 where transmitter, receiver, and/or groundsilver traces are desired.

At 1240, method 1200 includes using a laser to ablate excess silverpaste to define silver traces. For example, method 1200 may includeusing a laser to ablate portions of silver paste 810 to define secondset of silver traces 860 that may include transmitter, receiver, and/orground silver traces.

At 1250, method 1200 includes printing an insulation layer on the secondlayer to substantially cover the silver traces defined, where theinsulation layer includes an opening that leaves a portion of the groundsilver trace exposed. For example, method 1200 includes printing aninsulation layer 910 on sensor glass 290 that substantially coverssecond set of silver traces 860 that may include transmitter, receiver,and/or ground silver traces. Insulation layer 910 may include opening915 that leaves ground silver trace 930 of silver paste 810 exposed.

At 1260, method 1200 includes printing a shielding layer on theinsulation layer. For example, method 1200 may include printingshielding layer 960 on insulation layer 910 where shielding layer 960 iscoupled to ground silver trace 930 due to opening 915.

FIG. 13 illustrates an example of a method 1300 for combining a coverglass assembly and a sensor glass assembly, according to an exemplaryembodiment of the disclosure. For explanation purposes, FIG. 13 may bedescribed with elements from previous figures.

At 1310, method 1300 includes assembling a cover glass with a sensorglass, where the silver traces of the cover glass overlap the silvertraces of the sensor glass, where the overlapped silver traces areseparated by the shield layer and the insulation layer, and the overlapoccurs within a narrow border (e.g., is not in a viewing area). Forexample, method 1300 may include combining cover glass assembly 600 withsensor glass assembly 990, where first set of silver traces 560substantially overlap second set of silver traces 860 y, where theoverlapped silver traces are separated by shield layer 960 y and/orinsulation layer 910 y. The overlapped silver traces are: located withinsecond insulating BM layer 610; within narrow border 130; and not withinview area 152 of FIG. 1C.

At 1320, method 1300 places the silver traces of the cover glass and thesilver traces of the sensor glass in proximity to share a commonconnector. For example, method 1300 may place first set of silver traces560 or silver paste 510 in proximity with second set of silver traces860 y to share a common connector.

At 1330, method 1300 applies an adhesive layer between the secondinsulating BM layer of the cover glass and the shield layer of thesensor glass. For example, method 1300 may include applying adhesive 283between cover glass assembly 600 and sensor glass assembly 990. Inanother example, adhesive 283 may be between second insulating BM layer610 and shield layer 960 y.

Various embodiments can be implemented, for example, using one or morewell-known computer systems, such as computer system 1400 shown in FIG.14. Computer system 1400 can be any well-known computer capable ofperforming the functions described herein such as PCAP touchscreen 105of FIG. 1 and/or display device 110. Computer system 1400 may beinternal or external to PCAP touchscreen 105 and/or display device 110as discussed above. For example, portions of computer system 1400 may beincluded as PCAP touchscreen 105 and/or display device 110. In addition,PCAP touchscreen 105 may be used in conjunction with another computersystem 1400. In another example, computer system 1440 may be used toperform methods 1100, 1200, and/or 1300 described in FIGS. 11-13.

Computer system 1400 includes one or more processors (also calledcentral processing units, or CPUs), such as a processor 1404. Processor1404 is connected to a communication infrastructure or bus 906. One ormore processors 1404 may each be a graphics processing unit (GPU). In anembodiment, a GPU is a processor that is a specialized electroniccircuit designed to process mathematically intensive applications. TheGPU may have a parallel structure that is efficient for parallelprocessing of large blocks of data, such as mathematically intensivedata common to computer graphics applications, images, videos, etc.Computer system 900 also includes user input/output device(s) such asmonitors, keyboards, pointing devices, etc., that communicate withcommunication infrastructure 1406 through user input/output interface(s)1402.

Computer system 1400 also includes a main or primary memory 1408, suchas random access memory (RAM). Main memory 908 may include one or morelevels of cache. Main memory 1408 has stored therein control logic(i.e., computer software) and/or data. Computer system 1400 may alsoinclude one or more secondary storage devices or memory 1410. Secondarymemory 1410 may include, for example, a hard disk drive 1412 and/or aremovable storage device or drive 1414. Removable storage drive 1414 maybe a floppy disk drive, a magnetic tape drive, a compact disk drive, anoptical storage device, tape backup device, and/or any other storagedevice/drive.

Removable storage drive 1414 may interact with a removable storage unit1418. Removable storage unit 1418 includes a computer usable or readablestorage device having stored thereon computer software (control logic)and/or data. Removable storage unit 1418 may be a floppy disk, magnetictape, compact disk, DVD, optical storage disk, and/any other computerdata storage device. Removable storage drive 1414 reads from and/orwrites to removable storage unit 1418 in a well-known manner.

According to an exemplary embodiment, secondary memory 1410 may includeother means, instrumentalities or other approaches for allowing computerprograms and/or other instructions and/or data to be accessed bycomputer system 1400. Such means, instrumentalities or other approachesmay include, for example, a removable storage unit 1422 and an interface1420. Examples of the removable storage unit 1422 and the interface 1420may include a program cartridge and cartridge interface (such as thatfound in video game devices), a removable memory chip (such as an EPROMor PROM) and associated socket, a memory stick and USB port, a memorycard and associated memory card slot, and/or any other removable storageunit and associated interface.

Computer system 1400 may further include a communication or networkinterface 1424. Communication interface 1424 enables computer system1400 to communicate and interact with any combination of remote devices,remote networks, remote entities, etc. (individually and collectivelyreferenced by reference number 1428). For example, communicationinterface 1424 may allow computer system 1400 to communicate with remotedevices 1428 over communications path 1426, which may be wired, and/orwireless, and which may include any combination of LANs, WANs, theInternet, etc. Control logic and/or data may be transmitted to and fromcomputer system 1400 via communication path 1426.

In an embodiment, a tangible, non-transitory apparatus or article ofmanufacture comprising a tangible computer useable or readable mediumhaving control logic (software) stored thereon is also referred toherein as a computer program product or program storage device. Thisincludes, but is not limited to, computer system 1400, main memory 1408,secondary memory 1410, and removable storage units 1418 and 1422, aswell as tangible articles of manufacture embodying any combination ofthe foregoing. Such control logic, when executed by one or more dataprocessing devices (such as computer system 1400), causes such dataprocessing devices to operate as described herein.

The foregoing description, for purposes of explanation, used specificnomenclature to provide a thorough understanding of the disclosure.However, it will be apparent to one skilled in the art that specificdetails are not required in order to practice the disclosure. Thus, theforegoing descriptions of specific embodiments of the disclosure arepresented for purposes of illustration and description. They are notintended to be exhaustive or to limit the disclosure to the preciseforms disclosed; obviously, many modifications and variations arepossible in view of the above teachings. The embodiments were chosen anddescribed in order to best explain the principles of the disclosure andits practical applications, they thereby enable others skilled in theart to best utilize the disclosure and various embodiments with variousmodifications as are suited to the particular use contemplated. It isintended that the following claims and their equivalents define thescope of the disclosure.

Based on the teachings contained in this disclosure, it will be apparentto persons skilled in the relevant art(s) how to make and useembodiments of the disclosure using data processing devices, computersystems and/or computer architectures other than that shown in FIG. 14.In particular, embodiments may operate with software, hardware, and/oroperating system implementations other than those described herein.

It is to be appreciated that the Detailed Description section, and notthe Abstract section, is intended to be used to interpret the claims.The Abstract section may set forth one or more, but not all exemplaryembodiments, of the disclosure, and thus, are not intended to limit thedisclosure and the appended claims in any way.

The disclosure has been described above with the aid of functionalbuilding blocks illustrating the implementation of specified functionsand relationships thereof. The boundaries of these functional buildingblocks have been arbitrarily defined herein for the convenience of thedescription. Alternate boundaries may be defined so long as thespecified functions and relationships thereof are appropriatelyperformed.

It will be apparent to those skilled in the relevant art(s) that variouschanges in form and detail can be made therein without departing fromthe spirit and scope of the disclosure. Thus the disclosure should notbe limited by any of the above-described exemplary embodiments. Further,the claims should be defined only in accordance with their recitationsand their equivalents.

What is claimed is:
 1. A method for fabricating a projected capacitive (PCAP) touchscreen, comprising: assembling a cover glass with a sensor glass, wherein a first set of silver traces of the cover glass overlap a second set of silver traces of the sensor glass, wherein the overlapped first and second sets of silver traces are separated by a shield layer and an insulation layer, wherein the overlap occurs within a border, and wherein the first and second sets of silver traces share a common connector; and applying an adhesive between a first insulating black mask (BM) layer of the cover glass and the shield layer.
 2. The method of claim 1, further comprising: disposing on the cover glass, a first transparent electrode; printing a second insulating BM layer on the cover glass, wherein the second insulating BM layer includes a first opening above an electrode terminus of the first transparent electrode; and printing a portion of a conductive black via (BV) in the first opening, wherein the portion of the conductive BV is coupled to the electrode terminus and coupled to a first silver trace of the first set of silver traces.
 3. The method of claim 2, further comprising: printing a silver paste on the portion of the conductive BV and on the second insulating BM layer where transmitter and receiver silver traces are desired; and using a laser to ablate excess silver paste.
 4. The method of claim 3 wherein the using the laser to ablate excess silver paste comprises: leaving a deposit of the silver paste within a boundary of the portion of the conductive BV wherein the deposit is coupled to the first silver trace; and defining remaining silver traces of the first set of silver traces.
 5. The method of claim 3, wherein the using the laser to ablate excess silver paste comprises: creating a gap through the silver paste and the second insulating BM layer to the cover glass, wherein the first insulating BM layer fills the gap.
 6. The method of claim 5, further comprising: printing the first insulating BM layer that covers the first set of silver traces except a second opening that exposes leads of the first set of silver traces to be coupled with the common connector.
 7. The method of claim 1, further comprising: disposing on the sensing glass, a second transparent electrode; printing a second silver paste on the sensing glass where transmitter and receiver silver traces are desired; and using a laser to ablate excess second silver paste.
 8. The method of claim 7, further comprising printing the insulation layer to substantially overlap the second set of silver traces within the border, wherein the shield layer is printed on the insulation layer.
 9. The method of claim 8, wherein the printing the second silver paste on the sensing glass comprises printing a ground silver trace; and wherein the printing the insulation layer comprises printing the insulation layer around a second opening that exposes the ground silver trace to the shield layer.
 10. The method of claim 1, wherein the adhesive is a solid optically clear adhesive (OCA) comprising: an acrylic-based adhesive, a silicone-based adhesive, polyvinyl butyral (PVB), or ethylene-vinyl acetate (EVA).
 11. A projected capacitive (PCAP) touchscreen, comprising: a cover glass assembled with a sensor glass, wherein a first set of silver traces of the cover glass overlap a second set of silver traces of the sensor glass, wherein the overlapped first and second sets of silver traces are separated by a shield layer and an insulation layer, wherein the overlap occurs within a border of the PCAP touchscreen, and wherein the first and second sets of silver traces share a common connector; and an adhesive applied between a first insulating black mask (BM) layer of the cover glass and the shield layer.
 12. The PCAP touchscreen of claim 11, further comprising: the cover glass comprising a first transparent electrode; a second insulating black mask (BM) layer on the cover glass, wherein the second insulating BM layer includes a first opening above an electrode terminus of the first transparent electrode; and a portion of a conductive black via (BV) in the first opening, wherein the portion of the conductive BV is coupled to the electrode terminus and coupled to a first silver trace of the first set of silver traces.
 13. The PCAP touchscreen of claim 12, further comprising: a silver paste printed on the portion of the conductive BV and on the second insulating BM layer where transmitter and receiver silver traces are desired; and excess silver paste ablated by a laser.
 14. The PCAP touchscreen of claim 13, wherein the laser ablation of the excess silver paste comprises: a deposit of the silver paste within a boundary of the portion of the conductive BV wherein the deposit is coupled to the first silver trace; and remaining silver traces of the first set of silver traces.
 15. The PCAP touchscreen of claim 13, wherein the laser ablation of the excess silver paste comprises: a gap through the silver paste and the first insulating BM layer to the cover glass, wherein the first insulating BM layer fills the gap.
 16. The PCAP touchscreen of claim 15, wherein the first insulating BM layer covers the first set of silver traces except a second opening that exposes leads of the first set of silver traces to be coupled with the common connector.
 17. The PCAP touchscreen of claim 11, further comprising: the sensing glass parallel to the cover glass, comprising a second transparent electrode coupled to a second silver trace of the second set of silver traces; a second silver paste printed on the sensing glass where transmitter and receiver silver traces are desired; and excess second silver paste ablated by a laser.
 18. The PCAP touchscreen of claim 17, further comprising an insulation layer printed to substantially overlap the second set of silver traces within the border of the PCAP touchscreen, wherein the shield layer is printed on the insulation layer.
 19. The PCAP touchscreen of claim 18, wherein the silver paste printed on the sensing glass comprises a ground silver trace; and wherein the insulation layer is printed around a second opening that exposes the ground silver trace to the shield layer.
 20. The PCAP touchscreen of claim 11, wherein the adhesive is a solid optically clear adhesive (OCA) comprising: an acrylic-based adhesive, a silicone-based adhesive, polyvinyl butyral (PVB), or ethylene-vinyl acetate (EVA). 